EP5087 is a two-component fast curing thermally conductive adhesive, sealant and potting compound. It is designed to deploy heat in electronic applications, with a measured thermal conductivity of 1.5 W/mK. Suitable for metal, plastics, ceramics and ferrite bonding applications.
| Base | Epoxy |
| Colour | Gray |
| Viscosity (mPas) | Paste – 35000 |
| Temperature Resistance (oC) | -40oC / 150oC |
