EP2669 is a two-component, room temperature cure, adhesive, potting, casting and coating material that is two thermally conductive and electrically insulating.
EP2669 is two component, room temperature cure, thermally conductive, electrically insulating adhesive, potting, casting and coating material. Due to its content, it can be used in very low temperatures. It can be used for cryogenic applications. It provides an excellent thermal conductivity in high temperatures. Due to the fact that it can be cured in room temperature, it can be safely used on heat sensitive products.
Application Areas
Materials with high heat dissipation.
| Base | Epoxy |
| Viscosity (mPas) |
70000 |
| Full Cure (hour) | 24 |
| Temperature Resistance (oC) | -75oC / 135oC |
