EP1003

EP1003 is a two-component, high strength thermally conductive adhesive, encapsulation and potting compound. It is designed to deploy heat in electronic applications, with a measured thermal conductivity of 3 W/mK. EP1003 has high Tg (greater than 200°C according cure cycle), very low coefficient of thermal expansion (15 ppm/K), high ionic purity, and consequently recommended for encapsulation of electronic components.