Electrically conductive, flexible epoxy adhesive. Designed for bonding electronic and mechanical components.
ELTECH 258 is a pure silver filled two part electrically conductive flexible epoxy adhesive which flexible bondlines, sealing or low solder joint stress needed. ELTECH 258 is designed for bonding
electronical and mechanical attachments on electronic devices.
| Mixing Ratio (by weight) | 100 (Part A) / 100 (Part B) |
|---|---|
| Viscosity | Paste-like |
| Color | Silver |
| Density | 2.6 – 3 |
